XK-G40

Thermal conductivity 4.0W/mK

Low thermal resistance

Ultra thin bondline

Conforming with wet out

Design for low stress application

Automotive electronics;

Comsumer electronics;

Telecommunications;

Computer and peripherals;

XK-G40 has a thermal conductivity of4.0W/mK,providing high thermal performance. It requires no cureing and mixing, suitable for automated dipensing system.It deflects under very low compressive forces, decreasing stress on components.XK-G40 is designed to eliminate hand assembly time consuming, reducing installation cost.

With the advancement of 5G technology, 5G infrastructures are deployed in any area. The 5G modules generate significant demend for thermal management solutions and thermal interface materials. Aiming to solve the thermal management challenges of 5G devices such as radio units, baseband units, servers and routers etc, GLPOLY has launched exceptional performance thermal gel XK-G40 in 2019.

GLPOLY XK-G40 thermal gel is a liquid gap filling material with 4.0W/mK thermal conductivity designed to improve thermal contact, decrease stress on component.

We used to apply thermal gap pad in thermal management, sometimes, there would be some problems. If a certain amount of compression is required, the compressive force may destroy the chip. How can we fix this problem?

A 5G telecom equipment consulted us about thermal management solution. they used a thermal gap pad with a thermal conductivity of 3.6W/mK, the performance is good enough when they tested the thermal pad, but heat dissipating is not as good as expected. The supplier told them the interface contact is not tight enough, and requested customer to place much more compressive forces. Finally, this resulted in destroy to chip.

As we learned about this application, we knew the strain was what it mattered. GLPOLY had designed a sort of thermal gel to fix problem like this. We recommended XK-G40 high performance thermal gel with a thermal conductivity of 4.0W/mK which was verified by third party to customer. This material deflects under low compressive force, decreasing stress on component thus decreasing components failure.

GLPOLY XK-G40 is high performance, thermally conductive, liquid gap filling material designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer purchasing complexity. This material is one-component packaged, suitable for automated dispense processes, improving productivity. It provides similar performance to THERM-A-GAP GEL37.

GLPOLY thermal management materials had been applied to 5G telecom equipment, automotive electroncis and EV battery pack and ECU in leading enterprises such DT Mobile, Quectel Wireless, GAC Motor, NIO Motor and more.

GLPOLY is ready to help you solve thermal management issues with pioneering thermal management solutions and superior service.

1. Thermal conductivity 4.0W/mK, taking top spot on list of similar products, competing against top brands only;

2. Deforms under low compression force, decreasing stress on component thus decreasing component failures;

3. Conforms to uneven interface and, and is fit to fill intricate gap for fragile component;

3. Natural tacky, stick-in-place, cures into sheet, in place of thermal gap pad;

4. Compatible with high volume, automated dispense processes, reducing installation cost and eliminating time consuming handle assembly;

5. Cartridge or pail package decreases purchasing and logistics complexity;

6. Accommodates a variety of bond line thickness to multiple devices, providing superior design flexibility;

GLPOLY XK-G40 thermal gel is designed for 5G telecom modules, such as routers, optical transceivers, etc. It deflects under low compressive force, decreasing stress on components, thus decreasing component failures. This thermal gel can be dispensed easily, and is compatible with high volume, automated dispense processes.