Epoxy potting sealants WOC-87-II(A)/113(B)
■ Description
Two-component encapsulating system based on epoxy resin, formed from auxiliaries including epoxy resin, diluent, Aluminum hydroxide,compoundamine, cross-linking agent and defoamer by special production processing
Excellent of the surface gloss of the cured epoxy resin, excellentelectrical properties and have flame retardant property.
■ Applications
Encapsulation of electrical components of Capacitor, Igniter, Transformer, trigger and Filter.
■ General properties
|
Test Item |
Test Mothed/Conditions |
WOCC-87-II A |
113 B |
|
Appearance |
Visualization |
Black viscous liquid |
Dark brown liquid |
|
Density |
25º C g/m³ |
||
|
Viscosity |
40º C mpa.s |
1000 - 5000 |
20 - 45 |
|
Viscosity(blended) |
40º C mpa.s |
350±200 |
|
|
Storage validity |
Sealed and storage Temp.below 25º C |
6 months |
6 months |
|
Ratio of blend |
Weight/Weight |
100 |
20-25 |
|
Curing condition |
º C/hrs |
25 º C/24h or 60º C/2h |
|
■ Characteristics after curing
|
Item |
Unit/Conditions |
WOCC-87-II A/113 B |
|
Hardness |
20º C Shore-D |
＞70 |
|
Insulation Strength |
25º C kv/mm |
≥17 |
|
Bending Strength |
Kg/cm2 |
≥82 |
|
Heat/cold Shock Resistance |
-20 to 80º C |
Cycle times: more than 5 |
|
Flame Retardancy |
UL 94 |
V0 or V1 |
|
Surface Resistance |
25º C Ω.cm |
＞1013 |
|
Volume Resistance |
25º C Ω.cm |
＞1014 |
|
Curing Shrinkage Rate |
% |
＜0.6 |
■ Storage, Packaging
- Sealed and storage Temperature below 25º C after each operation
- Please see the term of validity in each packages
- Packages: A component is 25kg, B component is 10kg or 25kg
- The storage validity is 6 months, a little precipitate shall be occurred provided high temperature. Please stir the material before using.
Note: The above data was tested under the conditions of 70% humidity and 25º C Temperature, This is for your reference only.
Send product request
Other supplier products
 |
Epoxy Resin Adhesive for Battery EC-42 | ■ Description Adhesive for Cover container: is mainly used for the seal bond of cover and container. Excellent bond strength, good acid resistanc... |
 |
Epoxy potting adhesives WOC-5203(A)/WOC-5203 (B) | ■ Description Two-component encapsulating system based on epoxy resin, is room temperature curing as well as middle temperature curing epoxy resin... |
 |
Epoxy Resin Adhesive for Battery EC-32 | ■ Description Adhesive for Cover container: is mainly used for the seal bond of cover and container. Excellent bond strength, good acid resistanc... |
 |
Epoxy potting sealants WOC-87-II(A)/2115(B) | ■ Description Two-component encapsulating system based on epoxy resin,formed from auxiliaries including epoxy resin, diluent, compoundamine, cross... |
 |
Epoxy Resin Adhesive for Battery EC-200 | ■ Description Adhesive for Terminal(coloring adhesive):is mainly used for sealing signs of the battery terminal. High bond strength, good acid re... |
Same products
 |
Automotive & Marine Adhesive Sealant | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | Automotive & Marine Adhesive Sealant is designed for demanding bonding and sealing appli... |
 |
MS waterproof coating sealant | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | MS waterproof coating sealant MS Waterproof Coating Sealant GluePro is designed for liquid-... |
 |
MS Polymer Sealant For Window and Door | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | MS Polymer Sealant For Window and Door GluePro is designed for professional home decoration,... |
 |
ODM-606 Water-Based Intumescent Firestop Sealant | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | ODM-606 Water-Based Intumescent Firestop Sealant ODM-606 WATERBORNE FIRESTOP SEALANT is an ... |
 |
electronic potting compound supplier | Seller: Ordovician Mind (Zhengzhou) Technology Co., Ltd. | electronic potting compound supplier Ordovician Mind manufactures a comprehensive range of E... |
