PCB Assembly

Flex, rigid flex, and rigid PCB form factorsSMT, through-hole, and mixed technologyBoard sizes up to 18” x 14”Complex, high density assembliesPBGA, CBGA, TBGA, FPGA, CGA, LGAPackage on Package (PoP) assemblyMicro BGA (0.4mm)0402s, 0201s, 01005sWave and selective soldehttp://www.hemeixinpcb.com


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