PCM XK-C16
Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Good electrical insulation Applications Power semiconductor CPU and GPU Power conversion Description XK-C16 is a kapton(PI) reinforced, high performance thermal material with excellent dielectric peroperties, this product is solid pad at room temperature for ease of assembly, above its phase change temperature, it will soften or liquifiy and wet out interface, improving interface contact and providing lower thermal contact resistance.
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XK-G32 | Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applica... |
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XK-G40 | Features Thermal conductivity 4.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application App... |
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XK-S20 | Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1... |
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