AssembLED LED Board PCB
Quick Details
Place of Origin: Guangdong, China (Mainland), Guangdong China (Mainland)
Brand Name: Circuit board car led light pcb
Model Number: BM-011
Base Material: FR4
Copper Thickness: 1oz
Board Thickness: 1.0mm-1.6mm
Min. Hole Size: 0.25mm
Min. Line Width: 0.075um(3mil)
Min. Line Spacing: 0.075um(3mil)
Surface Finishing: HASL lead free/ENIG
Layer: 2,4,6,8
Min.line width: 3mil (0.075mm)
Min.line spacing: 3mil (0.075mm)
Min.hole size: 0.25mm
Solder mask: green, red,black,blue,yellow
Copper thickness: 0.5 oz,1oz
Quality certification: ISO14001:2004,ISO9001:2000
certificate: UL,ROSH,CE,CCC. ect
bare pcb package: Blister bag, PE bag,ESD Bag
Packaging & Delivery
Packaging Details:
Carton Box with Vaccum Anti-static bag inner
Delivery Detail:
15 days
Welcome To Moko
One stop Electronic manufacturing service
Moko, your single point of contact for all of your raw materials, parts, and PCB assembly, also offers:
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
Electronics Printed Circuit Board Manufacture
PCB Technical Specification
layer
1-18 layer
Material
FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2
Board thickness
0.2mm-4mm
Max.finished board side
800*508mm
Min.drilled hole size
0.25mm
min.line width
0.075mm(3mil)
min.line spacing
0.075mm(3mil)
Surface finish/treatment
HALS/HALS lead free,Chemical tin,Chemical Gold,
Immersion gold Immersion Silver/Gold,Osp,Gold Plating
Copper thickness
0.5-4.0oz
Solder mask color
green/black/white/red/blue/yellow
Inner packing
Vacuum packing,Plastic bag
Outer packing
standard carton packing
Hole tolerance
PTH:±0.076,NTPH:±0.05
Certificate
UL,ISO9001,ISO14001,ROHS,CQC
profiling punching
Routing,V-CUT,Beveling
PCBA Capabilities
Quantity
Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000
Type of Assembly
SMT,Thru-hole
Solder Type
Water Soluble Solder Paste,Leaded and Lead-Free
Components
Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Bare Board Size
Smallest:0.25*0.25 inches
Largest:20*20 inches
File Formate
Bill of Materials
Gerber files
Pick-N-Place file
Types of Service
Turn-key,partial turn-key or consignment
Component Packaging
Cut Tape,Tube,Reels,Loose Parts
Turn Time
Same day service to 15 days service
Testing
Flying Probe Test,X-ray Inspection AOI Test
PCB Assembly Process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
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