覆铜板
Specification:
CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm
Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k
Dielectricthickness:80um-150um
Copperfoil:1OZ,2OZ,3OZ
Supplysize:500*600mm/400*1200mm/500*1200mm/600*1200mm,Wecansupplyothersizeuponrequest.
ItemNo.:AL-H-06
Feature:
MeettheRoHSrequirements
Excellentthermalconductivity
Solderexcellentperformance
Outstandingreliability
Goodmachinability
Excellentdimensionalstability
Electromagneticwaveshielding
Application:
Coppercladlaminateistheelectronicindustrialbasematerial,mainlyusedforthemanufactureofprintedcircuitboard(PCB),widelyappliedintelevision,radio,computer,mobilecommunicationsandotherelectronicproducts.
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覆铜板 | Specification: CCLthickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm Thermalconductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k Dielectri... |
