printed circuit board
BaseMaterials:
CEM-1 CEM-3 FR-4 Teflon Rogers etc.
Layers:
Focus in 1-8 layers
Min Core material thickness:
3mil(excluding copper)
Prepregtype:
7628 2116 1080 3313
Max Board size:
520*720mm
Copper thickness
Base copper 1/3 OZ, HOZ, 1OZ, 2OZ,3OZ, 4OZ;Max Finished copper 6 OZ
Min Board thickness
2-layer 10mil; 4-layer 16mil; 6-layer 24mil; 8-layer 32mil; 10-layer 40mil
Max Board thickness
236mil(finished)
Min Line width/space
3mil/3mil
Min Through hole size
8mil
PTH wall copper thickness
≥1mil
Hole size tolerance
PTH±3mil, NPTH±2mil
Aspect ratio
8:1
V-CUT:
Angles 30°/45°/60°(+/-5°); Remain THK tolerance±4mil
Hole positional deviation
1st-drill ±3mil(Normal), ±2mil(Advanced); 2nd-drill ±4mil
Min Solder mask bridge:
3mil
Outline tolerance:
±4mil(Rout), ±5mil(Punch)
Twist & Bow
≤0.75%(Normal), ≤0.5%(Advanced);
Surface finish
HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F
Insulation Resistance
>10MΩNormal
Through hole resistance
≤0.05ΩNormal
Peel strength
1.4N/mm
S/M abrasion
>5H
Thermal stress
288℃ 10Sec 3times
Test Voltage
200-300V
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