Wafer Back Grinding Wheel
E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our back grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
Performance of Wafer Back Grinding Wheel
Leading technology
Good self-sharpening
No dressing required
High yeild rate of work-piece
Applications of Wafer Back Grinding Wheel
Used for wafer's back thinning in LED and Semiconductor industries.
Specifications of WaferGrinding Wheel
|
Product Specification |
|
|
Available shape |
6A2T |
|
Machine |
GALAXY, SPEEDFAM |
|
Working Condition |
|
|
Grinding Type |
Wet |
As a grinding wheel manufacturer, Henan E-Grind Abrasives Co., Ltd. is focused on providing efficient grinding solutions to customers. With more than 50 years of experience in the super abrasives industry, we're providing the best products, great service, and professional technical support that meet and exceed our customers' needs.
We can also offer kinds of diamond cut off wheelsfor sale, if you are interested, please contact us.
在线联系供应商
Other supplier products
 |
Dicing Blades With Hub | Disco Diamond Blade Our Disco dicing bladewith Hub is with a stronger edge, which makes the diamond blade discomore rigid and keeps the edge not t... |
 |
Grinding Wheels For Die & Tooling | E-Grind has developed PG wheels for precision grinding in Electronic mold industry. E-Grind wheels are peferct suitable for slotting, grooving and ... |
 |
Wafer Back Grinding Wheel | E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity ... |
 |
Dicing Blades With Hub | Disco Dicing Blade Our Disco diamond bladewith Hub is with a stronger edge, which makes the blade more rigid and keeps the edge not to be broken, ... |
 |
Dicing Blades Without Hub | The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith excellent cutting ability, good rigidity, and hig... |
Same products
 |
DEF Asscher Cut Moissanite | 卖方: Guangxi Wuzhou Starsgem Co., Ltd | DEF Asscher Cut Moissanite Product Introduction Material Moissanite Shape... |
 |
Melee Diamond 0.003ct to 0.15ct ( 0.8mm to 3.4mm ) Round Brilliant Cut HPHT Lab Grown Diamond | 卖方: Guangxi Wuzhou Starsgem Co., Ltd | Key Features: Size: Melee diamondsare generally less than 0.2 carats. They can range from very ... |
 |
Pink Lab Grown Diamond | 卖方: Guangxi Wuzhou Starsgem Co., Ltd | Material：HPHT / CVD Lab Grown Diamond Shape：Fancy Shape Carat：0.1ct to 3.0ct Color：Faint pink/... |
 |
8×8mm Asscher Cut Blue Diamond Color Moissanite 10K Rose Gold Engagement Ring | 卖方: Guangxi Wuzhou Starsgem Co., Ltd | 8×8mm Asscher Cut Blue Diamond Color Moissanite10K Rose Gold Engagement Ring Product Descr... |
 |
Starsgem 1ct D VVS2 Oval Brilliant Cut IGI HPHT Lab diamond | 卖方: Guangxi Wuzhou Starsgem Co., Ltd | Starsgem 1ct D VVS2 Oval Brilliant Cut IGI HPHT Lab diamond Product Description Material：HPHT L... |
