.

Silicone Soldering Pad for Heat Resistance and Stability

2UUL BH15 MagGrid Pad 芯片硅胶缓冲焊盘,适用于手机 CPU Nand Flash IC BGA 芯片焊接维修。2UUL BH15 MagGrid 磁性硅胶垫,芯片槽尺寸为 0.3mm、0.4mm、0.5mm 和 0.8mm,适用于各种手机 CPU Nand 芯片和 BGA 芯片的焊接、植球和维修。

产品参数:
名称:2UUL BH15 MagGrid Pad 芯片硅胶缓冲焊盘
净重:65.5 克
产品尺寸:104mm x 80mm x 8mm
包装尺寸:130mm x 84mm x 11mm
毛重:78.5 克

产品特点:
1. 橡胶磁吸锡垫,柔软硅胶材质,强磁吸附,耐高温,易于清洁。
2. 弧形设计,强磁吸附,无缝贴合,解放双手。
3. 使植锡网BGA钢网不易脱落、移位,使芯片植锡更加牢固稳定。
4. 植锡孔散热滚轮,植锡网背面镂空散热孔设计,植锡网散热效果好,植锡网植锡网不会鼓包。
5. 耐高温,柔软硅胶,弹性缓冲,可承受高达500℃的高温。


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