Sinopack Hermetic Ceramic Packages for MEMS Sensors
Sinopack offers hermetic ceramic packages with superior mechanical properties, suitable for small, high density, and surface mountable applications - including accelerometers and angular rate, pressure, optical and RF sensors.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack Ceramic Packages for Uncooled Infrared Detectors |
Existing packages using BTF structure, oxygen-free copper and package integration, has the characteristics of more fuses, high reliability. Maximum... |
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Sinopack Hermetic Ceramic Packages for MEMS Sensors |
Sinopack offers hermetic ceramic packages with superior mechanical properties, suitable for small, high density, and surface mountable applications... |
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25Gbps Cooled TOSA Ceramic Packages with lids |
Box packaging style with ceramic and metal structure, TEC attachable Structure. High frequency used for 100Gbps 10km/40km. Low Return Loss: -15dB m... |
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Sinopack Ceramic Packages for High Power Laser Devices |
Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conduct... |
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Fiber-Optic Communication Modules ceramic Packages with Submounts and Lids |
Sinopack produces an extensive range of packages for use in fiber-optic communication modules --including ceramic submounts, packages, lids. Our pr... |
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