Sinopack Standard Ceramic Packages with Lids for Device Evaluation
Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP), ceramic pin grid array packages (C-PGA), ceramic quad flat packages (C-QFP), ceramic quad flat J-leaded packages (C-QFJ) and ceramic quad flat non-leaded packages (C-QFN). Standard ceramic packages are useful in customer device evaluations and low volume orders, enabling customers to reduce tooling costs and design time.
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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ALN / Alumina substrates for semiconductor laser diodes and photodiodes | Sinopack provides ceramic submounts for semiconductor laser diodes and photodiodes in fiber-optic communication modules. Both aluminum nitride (AlN... |
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Sinopack Standard Ceramic Packages with Lids for Device Evaluation | Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP)... |
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Sinopack Ceramic Packages for Cooled Infrared Detectors | Ceramic Packages for Cooled Infrared Detectors plays a high airtight work condition, mechanical support and protection, the function of the circuit... |
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Surface Mount Ceramic Packages for Electronic Devices | Sinopack provides miniaturized surface mount ceramic packages with cavity structures available . Hermetic or vacuum-sealing is typically applied to... |
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Sinopack Hermetic Ceramic Packages for MEMS Sensors | Sinopack offers hermetic ceramic packages with superior mechanical properties, suitable for small, high density, and surface mountable applications... |
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