MaoFix-F1 Efficient Motherboard Repair Clip for Glue Removal

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Description
Amaoe MaoFix-F1 Multi-Function Repair Fixture for mobile motherboard clamps IC chip CPU degumming repair. Amaoe hidden screw design Multi-Function clamp for iPhone X-16 pro max motherboard fixing, chip degumming, BGA template bracket.

Features:
1. The hidden screw design prevents residue from falling into the screws, thereby improving durability.
2. Multi-function repair fixture for iPhone X to 16 Pro Max motherboard repair and chip degumming.
3. Durable structure: made of high-quality materials to ensure service life and reliability.
4. Motherboard repair, chip degumming, BGA template bracket.
5. High temperature resistant, non-heat transfer, anti-static.
6. 1-level motherboard slot, 3mm deep, 0.5mm wide, for motherboard repair; 2-level motherboard slot, 3mm deep, suitable for iPhone X-16 series motherboard; 3-level chip slot, 0.5mm deep, for chip degumming.
7. Total thickness 6.5mm, motherboard synthetic stone slot + chip metal chip slot.
8. Three-level step buckle design, 70mm clamping length, suitable for most mobile motherboard repairs.

Product Information:
Packaging weight: 325g.
Product weight: 325g.
Packaging size: 162*83*25cm.
Product size: 145*78*24cm.

Package List:
1 x MaoFix-F1 Fixture.

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