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Copper Base Copper Clad Laminate

Specification:

  1. Thermal conductivity:1.5W/m.k
  2. Dielectric thickness: 100um-350um
  3. Copper CCL thickness:0.6mm
  4. Copper foil:1OZ
  5. Supply size:500×600mm/400×1200mm/500×1200mm/600×1200mm,We can supply other size upon request.

Feature:

  1. Meet the ROHS requirements
  2. Excellent thermal conductivity
  3. Solder excellent performance
  4. Outstanding reliability
  5. Good machinability
  6. Excellent dimensional stability
  7. Electromagnetic wave shielding

Application:

1.High degree of LED lighting

2.LED blacklight

3.High power electronics components(high-power transistors,rectifiers)

4.Vehicle use (rectifier,power module)

8.Audio (equalizer,amplifier)


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