HDI PCB
HDI Capability
Item Specification
(Min Wire Width/Space)
Cu Foil) 2.5Mil/3Mil
(Plated Layer) 3Mil/3Mil
(Min Through Hole Size) 0.2mm
(Min Buired Hole Size) 0.15mm
(Min Core Thickness)
Non Plated 0.05mm
Plated 0.065mm
(Max Board Thickness) 2mm
(Max Layers) 14 Layer
(Stack Up type)
1+N+1, 2+N+2, 3+N+3,4+N+4
(Available Material):
EM220/EM320/TU752/TU662/EM285(HF)/EM280(HF)/NPG-TL(HF)
Send product request
Other supplier products
rigid PCB | Rigid PCB Capability 项目 技术指标 Item Specifications 加工层数 2-22层 Layers 2-22Layer 最小线宽/线距 Min Wire Width/Space 内层(Inner) 0.5OZ 3 Mil/3Mil 1OZ... | |
HDI PCB | HDI Capability Item Specification (Min Wire Width/Space) Cu Foil) 2.5Mil/3Mil (Plated Layer) 3Mil/3Mil (Min Through Hole Size) 0.2mm (Min ... |
Same products
PCB Surface | Seller: GreensTone (Shenzhen) Electronics Co., Limited | PCB surfacefinish include: PCB plating finishesis a coating between a component and a bare board ... | |
PCB Components Sourcing | Seller: GreensTone (Shenzhen) Electronics Co., Limited | GreensTone Electronics employs a dedicated, parts sourcing and procurement team to manage the log... | |
PCB Capability | Seller: GreensTone (Shenzhen) Electronics Co., Limited | GreensTone has successfully served customers with pcb manufacturing capabilitiesservice in commun... | |
PCB Assembly Service | Seller: GreensTone (Shenzhen) Electronics Co., Limited | GreensTone specializes in the pcba pcb assembly, including: Circuit board assembly Surface moun... | |
High-TG PCB | Seller: GreensTone (Shenzhen) Electronics Co., Limited | Glass Transition Temperature is referred to as Tg, and FR4 is a designation for a particular type... |