pcb
- DataInputs-Protel,DXP,Gerber,DXF,DWG,CAM
- MajorLaminate-Kingboard,ShengYiandothersproducebycustomerspecialrequest
- BaseMaterials-FR4,othermaterialsincludingHighTg,HighCTI,HalogenFreebyspecialrequested
- PCBMaximumboardsizeHASL:546mmx320mm,OSP:630mmx470mm,Ni/Au:570mmx470mm
- RigidPCBthicknessSingle-sidetoDoublesidefrom0.2mm-3.0mm4layers-0.4mm-3.0mm/6layers-0.6mm-3.0mm/8layers-1.0mm-3.0mm10layers-1.20mm-3.0mm/12layers-1.40mm-3.0mm(SmallrunandPrototypeonly)
- SurfaceFinishing-HAL/HASL,OSP,ImmersionGold,ImmersionTin
- CopperFoil-from0.5ozto6oz,innerlayerupto3oz
- Min.Holesize-0.20mm,Aspectratio=8
- Viaholes-CopperPTH,Blindvia
- HDI-Class1forsingleBlindvia
- Impedancecontroltolerance-+/-10%
- Min.LineWidthandSpacing-Max.0.10mm/0.10mm(4mil/4mil)
- Solderresistmask-LiquidPhoto-Image(LPI)
- SilkscreenINK-Thermal
- Profiling-Routing,V-cut,Punching,CNCV-cut,Pushback
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