Fe doped LT Wafers
Fe doped LT Wafers
Our abundance experience at growing and mass production for SAW grade Lithium Tantalate. We are equipped with advanced facilities at Crystal growing, wafer lapping, polishing and checking, all finished products are passed at Testing of curie Temp and QC inspection.
CQT supply lithium tantanlate wafer, which include fe doped lt wafers, saw grade lithium tantalate wafersand optical grade lithium tantalate wafers. We are committed to the supply of all types of substrate wafers to the microelectronics industry
Our R&D is active at developing and researching from new material to finished products at all kinds of Fe doped wafers & electronic components.
Product Parameters
|
Material |
LiTaO3 wafers（White or Black &Fe doped） |
|
|
Curie Temp |
603±2℃ |
|
|
Cutting Angle |
X/Y/Z/X112Y/Y36/Y42/Y48/etc |
|
|
Diameter/size |
3”/4”/6" LT wafer |
|
|
Tol(±) |
<0.20 mm |
|
|
Thickness |
||
|
Primary Flat |
22mm /32mm /42.5mm /57.5mm |
|
|
LTV (5mmx5mm) |
<1µm |
|
|
TTV |
<3µm |
|
|
Bow |
-30<bow<30 |
|
|
Warp |
<40µm |
|
|
PLTV(<0.5um) |
≥95%(5mm*5mm) |
|
|
Orientation Flat |
All available |
|
|
Surface Type |
Single Side Polished /Double Sides Polished |
|
|
Polished side Ra |
<0.5nm |
|
|
Back Side Criteria |
General is 0.2-0.5µm or as customized |
|
|
Edge Criteria |
R=0.2mm or Bullnose |
|
|
Fe doped |
Fe doped for saw grade LN< wafers |
|
|
Wafer Surface Criteria |
Transmissivity |
general:5.9x10-11<s<2.0*10-10at 25℃ |
|
Contamination, |
None |
|
|
Particles ￠>0.3 µ m |
<= 30 |
|
|
Scratch , Chipping |
None |
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|
Defect |
No edge cracks, scratches, saw marks, stains |
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|
Packaging |
Qty/Wafer box |
25pcs per box |
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