Gold OSP 6 layers mobile phone circuit board
Gold OSP 6 layers mobile circuit board
Gold OSP circuit board
1)Thickness: 0.1mm-5mm
2)Minimum linewidth：0.075mm/3mil
3)Minimum gap：0.065/2.8mil
4)Minimum apertureinradium：0.15mm
5)Minimum aperture external diameter：0.45mm
6)Minimum BGA: 0.2mm
7)Layer：6layers through hole non-impedance
All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
More information you can views here
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