PCB Capability
PCBFabrication Capabilities
GreensTone has successfully served customers with printed circuit boardmanufacturing service in communication, industial devices, new engrgy, power supply, sensors, smart home applications control, smart industial control , medical devices and security control device and so on.
GreensTone PCB Quality Control
For every orders we recieved, Gerber files should be checked by our PCB engineers before sending to production. Engineers would help to check the board edge clearance, drilling, pad spacing, impedance and routing. if the engineer finds a problem with the file or something can't be optimized, our engineers will contact the customer to confirm the files again.
The quality of the raw materials determines the quality of the finished products. GreensTone has been working with leading suppliers in the industry,and apply materials as to international standards and customer requirements, such as Rogers, Shengyi, KB (kingboard) sheet, Rohm&Haas, TAIYO for solder mask ink.
To ensure the quality and reliability of PCB products, GreensTone continuously introduces advanced equipment to improve their pcb manufacturing capabilities, including:
Automatic solder mask production line
LDI exposure machine
Fully automatic PCB etching equipments line
Fully automatic PCB testing machine line
Fully automatic electroplating line
Automatic silkscreen printing production line
Comply with ISO9001:2015 requirements
Production processes are in line with IPC standards
Basic visual inspections
Rigorous electrical tests.
Flying Probe Testing
AOI (Automated Optical Inspection)
Copper Thickness Tester
Specification of PCB Capability
|
Item |
PCB Capability |
|
Layers |
1-8 layers |
|
Thicker Copper |
1- 4OZ |
|
Products Type |
HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board, BGA& Fine Pitch board |
|
Solder Mask |
Red, green, yellow, white, blue, black, Matt black |
|
Base material |
FR4, HI-TG, heavy copper and so on |
|
Finished Surface |
Conventional HASL, Lead-free HASL, Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin, Immersion Silver, Hard Gold |
|
Technical Specification |
Minimum line width/gap: 3.5/4mil(laser drill) |
|
Minimum hole size: 0.15mm(mechanical drill)/4mil(laser drill) |
|
|
Minimum Annular Ring: 4mil |
|
|
Max Copper thickness: 4OZ |
|
|
Max Production size: 900×1200mm |
|
|
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm |
|
|
Min Solder Mask Bridge: 0.08mm |
|
|
Aspect ratio: 15:1 |
|
|
Plugging Visa capability: 0.2-0.8mm |
|
|
Tolerance |
Plated holes Tolerance: 0.08mm(min±0.05) |
|
Non-plated hole tolerance: 0.05min(min+0/-0.05mm or +0.05/-0mm) |
|
|
Outline Tolerance: 0.15min(min±0.10mm) |
|
|
Insulating resistance: 50 ohms (normality) |
|
|
Peel off strength: 1.4N/mm |
|
|
Thermal Stress test: 2650c,20 seconds |
|
|
Solder mask hardness: 6H |
|
|
E-Test voltage: 500V+15/-0V 30S |
|
|
Warp and Twist: 0.7% (semiconductor test board≤0.3% ) |
|
|
Silkscreen |
White, Black, None |
|
Panelization |
V-scoring, |
|
Tab-routing, |
|
|
Tab-routing with Perforation (Stamp Holes |
|
|
Others |
Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008 , UL Certificate |
As one of electronic contract manufacturing companies, we will do our best to meet all the needs of customers.
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