HIGH HEAT DISSIPATION MCPCB
Project Description
|Parameters
1 Layer
Thickness: 1.2+/-0.1 mm
Min Hole Size: 3.175 mm
Width/Space: 0.12mm/0.1 mm
Surface Treatment: OSP
|Craft
White Ink
3W Heat Dissipation Coefficient
|Application
LED Light
1 Layer
Thickness: 1.2+/-0.1 mm
Min Hole Size: 3.175 mm
Width/Space: 0.12mm/0.1 mm
Surface Treatment: OSP
|Craft
White Ink
3W Heat Dissipation Coefficient
|Application
LED Light
Отправить запрос, связаться с поставщиком
Другие товары поставщика
 |
Golden Finger PCB | Project Description |Parameters10 LayerThickness: 1.6+/-0.16 mmMin Hole Size: 0.15 mmWidth/Space: 0.12mm/0.1 mmSurface Treatment: ENIG+Gold Finger|... |
 |
4 Layer OSP+ENIG PCB | Project Description |Parameters4 LayerThickness: 1.2+/-0.12 mmMin Hole Size: 0.3 mmWidth/Space: 0.12mm/0.12 mmSurface Treatment: ENIG|CraftRed InkE... |
 |
2 Layer Board | Project Description |Parameters2 LayerThickness: 1.6+/-0.16 mmMin Hole Size: 0.3 mmWidth/Space: 0.15mm/0.12 mmSurface Treatment: ENIG|CraftNormal 2... |
 |
6 layer heavy ENIG board | Project Description |Parameters6 LayerThickness: 1.8+/-0.18 mmMin Hole Size: 0.25 mmWidth/Space: 0.2mm/0.2 mmSurface Treatment: ENIG|CraftGold Fing... |
 |
Immersion tin PCB | Project Description |Parameters2 LayerThickness: 0.6+/-0.1 mmMin Hole Size: 0.5 mmWidth/Space: 0.3mm/0.3 mmSurface Treatment: Immersion Silver|Craf... |
