TO-254 and TO-257 Ceramic Packages for Power Electronics
Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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Sinopack 40Gbps TOSA / ROSA Ceramic Packages for LR4 |
TOSA / ROSA Packages for QSFP+ Transceivers, Surface Mount Packages, XLMD-MSA Compliant BTF PKG Sinopack devotes to the R&D and manufacturing o... |
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Sinopack Hermetic Ceramic Packages for MEMS Sensors |
Sinopack offers hermetic ceramic packages with superior mechanical properties, suitable for small, high density, and surface mountable applications... |
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Sinopack Standard Ceramic Packages with Lids for Device Evaluation |
Sinopack offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP)... |
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Sinopack Ceramic Packages for High Power Laser Devices |
Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conduct... |
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Sinopack Ceramic Packages for Cooled Infrared Detectors |
Ceramic Packages for Cooled Infrared Detectors plays a high airtight work condition, mechanical support and protection, the function of the circuit... |
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