TO-254 and TO-257 Ceramic Packages for Power Electronics
Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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TOSA Ceramic Packages for Micro Integrable Tunable Laser Assembly (µ-ITLA) | Low Return Loss: -15dB max. (DC~15GHz) Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC,... |
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Butterfly Ceramic Packages for Integrable Tunable Laser Assembly (ITLA) | Low Return Loss: -20dB max. (DC~15GHz) Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC,... |
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Fiber-Optic Communication Modules ceramic Packages with Submounts and Lids | Sinopack produces an extensive range of packages for use in fiber-optic communication modules --including ceramic submounts, packages, lids. Our pr... |
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