MECHANIC 3D Middle Layer BGA Reballing Stencil for iPhone X A12

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Mechanic 3D stencil for iPhone X motherboard middle layer soldering repair. Mechanic 3D-X-PRO middle layer stencil with positioning base for iPhone X motherboard repair. Mechanic 3D Square Hole BGA Reballing Stencil steel mesh middle layer positioning tool for iPhone X A12.

Option:
1.3D-X stencil only: for iPhone X.
2.3D-X Pro stencil with base: for iPhone X

Description:
Mechanic 3D BGA Reballing Stencil for iPhone X Motherboard Middle Layer, iPhone X A12 PCB groove Reballing Stencil Template, New patented iPhone X Middle Layer Motherboard 3D BGA Reballing Stencil template, used for assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.

Features"

1. Made of high temperature resistant synthetic stone
2. 0.3mm thickness, easy to scrape tin, high strength, not easy to deform
3. Durable, easier to take off the net, more efficient
4. Mini size, can put under microscope for use,easy to observe
5. 3D Design,stable use, precise plate tin

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