8L Rigid Printed Circuit Boards (PCB) Fabrication Factory
8-layer printed circuit boards Layer:8L Material: FR4 TG170 Thickness:2.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.3mm Surface Finish: ENIG Finish Copper: 70μm
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Printed Circuit Boards (pcb) Fabrication China | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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Mobile Internet Devices (MID) Mainboards Chinese Factory | Mobile Internet Devices (MID) Mainboards Material: FR4 Surface finish: ENIG, HASL |
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Printed Circuit Board (pcb) with Shengyi FR4 material | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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12-layer High Density Interconnector (HDI) Boards Exporter | 12-layer High Density Interconnector boards Thickness:0.8mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.1mm Surface Finish: ENIG+OSP |
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IPC Class 2 and 3 PCBs Fabrication Prototype | Multilayer printed circuit boards Layer:2-30L Material: FR4, Roger Thickness:0.20mm-6.00mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.10mm-6.3... |
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