Backplanes Pcb Assembly
Pcb Assembly:Topscom's roots lie in the assembly and testing of printed circuit boards. Today,we support high and low-mix PCB and backplane assembly for volumes that range from just a few units for prototypes, to modest quantities for pre-production, to hundreds of thousands in volume production.Our pcb assembly services are complemented by front-end product development capabilities including strong CAD layout and design experience. And of course, quality is always first - we employ DFX fundamentals as well as quality and data-tracking methodologies.Pcb Assembly Capabilities:·01005,0201s ·CCGA ·COB ·CSPs ·Double sided, mirrored BGA assembly ·Double sided, single reflow processing ·Fine pitch high pin count press fit connectors ·Flip chip ·Lead-free assembly ·MCMs ·MEMs ·Mictor connectors ·uBGA ·Bare die attach ·Continuous flow SMT lines ·Optical splicing·Backplane Capabilities·SMT - large scale backplanes up to 24" x 24" ·PTH (plated through hole) - up to 24" wide ·Press-fit - up to 12 ton, closed-loop systems ·Process chemistry - aqueous and no clean ·Test - up to 33,792 test nodes
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Modems |
Peripherals consumer modems product pcba motherboards assembly electronics contract manufacturing services OEM CEM EMS experience company—China She... |
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Alternative PCB Finishes |
Topscom has conducted comprehensive evaluations of alternative PCB finishes including immersion silver (I-Ag) and immersion tin (I-Sn). Our studies... |
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Vertically Plastic Injection |
Topscom is a full service plastic injection molder. We have over 150 plastic injection molding machines . Topscom’s expertise in design and manufac... |
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Sheet Metal Stamping And Finis |
Topscom has stage transfer presses ranging from 45 to 250 tons, and more than 20 progressive die presses ranging from 200 to 800 tons. Our capabili... |
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Flip Chip Technologies |
Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different forms, inc... |
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