.

Introduction of Hf PCB

SinofasthighfrequencyPCBboardsarewidelyusedinwirelessnetworks,wirelesscommunicationsandsatellitecommunications.Inparticular,thepopularityof3G,4G,5GnetworksgreatlyincreasesthemarketdemandforAutomotivePCB.

Theincreasingcomplexityofelectroniccomponentsandswitchescontinuallyrequiresfastersignalflowrates,andthushighertransmissionfrequenciesisrequiredtomeetthesocialmarket.Ithasalsobecomemoreandmorenecessaryforhighfrequency(HF)technologytoviewconductorwidthsasanelectroniccomponent.

Basematerial:FR-4/FR-1/FR-2/CEM-1/CEM-3,Aluminum,Metalbased

Layercount:2-18

Thicknessoffinishedpanel:0.20mm-4.0mm

BoardThicknessTolerance:±10%

Innerlayer/OuterlayerBaseCooperthickness:0.5OZ(17um)/0.5OZ(17um)

Impedancetolerance:±10%

ImpedanceControl:50Ω

Warp&Twist:≤0.5%

Peelstrengthofline:≥61B/in(≥107g/mm)

Images:

Outerlayerlinewidth(a):0.075mm(3mil)

Outerlayerlinespace(b):0.075mm(3mil)

Imagetoimagetolerance:±0.075mm(±3mil)

SMDpitch(a):0.2mm(8mil)

BGApitch(b):0.2mm(8mil)

SolderMask:

Thicknessofsoldermask(lineend):0.4-1.2mil

Thicknessofsoldermask(linecorner):≥0.2mil

Hardnessofsoldermask:6H

Soldermaskregistrationtolerance:±2mil

Holes:

Mindrillingdiameter:0.15mm

Mindiameteroffinishedhole:0.10mm

ToleranceofPTHdiameter:±2mil(±50um)

ToleranceofNPTHdiameter:±1mil(±25um)

Choosingacircuitmaterialforahigh-frequencyPCBboardisgenerallyatrade-off,oftenbetweenpriceandperformance.ButPCBmaterialsarealsoselectedbytwokeyfactors:howwelltheymeettheneedsofanend-useapplicationandwhatkindofeffortisrequiredtofabricateadesiredcircuitwithaparticularmaterial.

SinoFastprocesseshigh-frequencymaterialswithimproveddielectricproperties.Thesehaveaverylowlossfactor,lowdielectricconstant,andarefrequencyindependent.

Forsomespecialhigh-frequencyPCBmaterials,suchas:TeflonPCBmaterial,RogersPCBmaterials,wealsohavetheproductionability.

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