Introduction of Hf PCB
SinofasthighfrequencyPCBboardsarewidelyusedinwirelessnetworks,wirelesscommunicationsandsatellitecommunications.Inparticular,thepopularityof3G,4G,5GnetworksgreatlyincreasesthemarketdemandforAutomotivePCB.
Theincreasingcomplexityofelectroniccomponentsandswitchescontinuallyrequiresfastersignalflowrates,andthushighertransmissionfrequenciesisrequiredtomeetthesocialmarket.Ithasalsobecomemoreandmorenecessaryforhighfrequency(HF)technologytoviewconductorwidthsasanelectroniccomponent.
Basematerial:FR-4/FR-1/FR-2/CEM-1/CEM-3,Aluminum,Metalbased
Layercount:2-18
Thicknessoffinishedpanel:0.20mm-4.0mm
BoardThicknessTolerance:±10%
Innerlayer/OuterlayerBaseCooperthickness:0.5OZ(17um)/0.5OZ(17um)
Impedancetolerance:±10%
ImpedanceControl:50Ω
Warp&Twist:≤0.5%
Peelstrengthofline:≥61B/in(≥107g/mm)
Images:
Outerlayerlinewidth(a):0.075mm(3mil)
Outerlayerlinespace(b):0.075mm(3mil)
Imagetoimagetolerance:±0.075mm(±3mil)
SMDpitch(a):0.2mm(8mil)
BGApitch(b):0.2mm(8mil)
SolderMask:
Thicknessofsoldermask(lineend):0.4-1.2mil
Thicknessofsoldermask(linecorner):≥0.2mil
Hardnessofsoldermask:6H
Soldermaskregistrationtolerance:±2mil
Holes:
Mindrillingdiameter:0.15mm
Mindiameteroffinishedhole:0.10mm
ToleranceofPTHdiameter:±2mil(±50um)
ToleranceofNPTHdiameter:±1mil(±25um)
Choosingacircuitmaterialforahigh-frequencyPCBboardisgenerallyatrade-off,oftenbetweenpriceandperformance.ButPCBmaterialsarealsoselectedbytwokeyfactors:howwelltheymeettheneedsofanend-useapplicationandwhatkindofeffortisrequiredtofabricateadesiredcircuitwithaparticularmaterial.
SinoFastprocesseshigh-frequencymaterialswithimproveddielectricproperties.Thesehaveaverylowlossfactor,lowdielectricconstant,andarefrequencyindependent.
Forsomespecialhigh-frequencyPCBmaterials,suchas:TeflonPCBmaterial,RogersPCBmaterials,wealsohavetheproductionability.
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