Optoelectronic device package gold plated
Professional electronic package housing manufacturer, company collection housing
Design, processing and sales. At the same time in electronic packaging materials
The surface treatment process of the material is extremely mature and stable.
Effective treatment of aluminum silicon, aluminum silicon carbide, tungsten copper, molybdenum copper, titanium alloy
Special materials such as stainless steel, with mature glass---metal burning
Knotted process and more complete electroplating to meet the different needs of customers
Can be plated with high solderability pure Au, Ni。 nickel, Ag, Cu,
Hard chrome, decorative chrome, etc. The company has strong technical strength and is willing to work with customers.
In-depth cooperation to solve customer problems in related fields
To achieve a win-win development for both parties.
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TiW/Au |
Metal film thickness100nm/500nm |
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Thin film attenuator chip |
DC18~67GHz
High precision attenuation and impedance
Typical: attenuation of 5 ± 0.1dB, impedance of 50 ± 2Ω |
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AL2O3,thin film circuit |
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