Blind Buried Vias & Hdi Pcb
Buried vias PCB & blind vias PCB, use micro blind vias to increase the trace distribution density. Improve radio frequency, electromagnetic wave interference and hear conduction. Apply to computer server, mobile and digital camera products.HUIHE CIRCUITS is China HDI PCB manufacturer, Our blind buried via PCB has passed ISO9001/ISO13485/IATF16949/UL/RoHS/REACH certification.
HDI Printed Circuit Boards & Blind Buried Via PCB List
10 Layer ENIG Blind Vias PCB
12 Layer ENIG PCB
14 Layer Blind Buried Via PCB
4 Layer ENIG Blind Buried Via PCB
6 Layer ENIG Blind Vias PCB
6 Layer HASL Blind Buried Via PCB
8 Layer ENIG Blind Buried Via printed circuit board manufacturers
8 Layer ENIG Blind Buried Via PCB
Are PCB Boards With Blind And Buried Vias Called HDI PCB?
HDI circuit boardsare high density interconnect PCB. The high density PCB that are plated with blind holes and then laminated are all HDI boards, which are divided into first-order, second-order, third-order, fourth-order, and fifth-order HDI. Simple buried vias are not necessarily HDI. .
The Difference Between hdi printed circuit boards And Ordinary PCB
Through Hole Circuit Board
Plating Through hole, or PTH for short, is the most common one. You only need to pick up the PCB and face the light, and the hole that can see the bright light is the "through hole". This is also the simplest type of hole, because when making it, you only need to use a drill or a laser to directly drill the through hole PCB. The cost is relatively cheap, but sometimes it will use more PCB space.
Blind Vias Hole
Blind via in PCB connects the outermost circuit of the PCB with the adjacent inner layer with electroplated holes. Because the opposite side cannot be seen, it is called "blind through". This manufacturing method requires special attention to the depth of the drilling (Z axis) to be just right; it is also possible to drill holes in the circuit layers that need to be connected in the individual circuit layers in advance, and then glue them together.
Buried Vias PCB
Buried hole, the connection of any circuit layer inside the PCB but not conducting to the outer layer. This process cannot be achieved by drilling after bonding. It must be drilled on the individual circuit layers. After the inner layer is partially bonded, it must be electroplated before it can be fully bonded. Compared with the original "through hole" and "Blind holes" take more time, so the price is the most expensive. This process is usually only used for high density interconnect PCB to increase the usable space of different types of PCB board layers.
Huihe Circuits is a professional printed circuit board makerandhdi pcb factory, we provide blind via in pcb, high density interconnect pcb, hdi pcb china, blind buried via pcb,
pcb boards for saleand etc.For hdi pcb price or more information, please feel free to contact us!
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6 Layer LF-HASL PCB | Number of layers: 6 Surface finish: LF-HASL Base material: FR4 Outer Layer W/S: 11/6mil Inner layer W/S: 16/5mil Thickness: 1.6mm Advantages ... |
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6 Layer ENIG PCB | Number of layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/2mil Inner layer W/S: 4/3mil Thickness: 1.6mm Advantages Of pc... |
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8 Layer ENIG Impedance Control Half Hole PCB | Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Special proc... |
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2 Layer Taconic ENIG PCB | Number of layers: 2 Surface finish: ENIG Base material: Taconic TLY-5A Outer Layer W: 1.046mil Outer layer S: /mil Thickness: 0.94mm Advantag... |
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2 Layer OSP Impedance Control Half Hole PCB | Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Special process: impedance control+half ho... |
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