BGA Assembly, Ball Grid Array Assembly, BGA Assembly For PCBs
MOKO has a vast amount of expertise in Ball Grid Array Assembly
(BGA). Our facilities house the most current BGA placement equipment as
well as X-ray inspection equipment. We have developed over the years BGA
assembly processes with a proven record of producing BGA circuit boards
with excellent yield rates and the highest quality in the electronics
manufacturing industry.Our BGA assembly equipment can process the following types of BGA applications:Size: micro BGAs (2mmX3mm) to large size BGAs (45 mm)Materials: ceramics and plasticsPitch: 0.4 mm (minimum)Optimizing the Thermal ProfilesTo ensure the highest quality of our BGA assembly processes, Bittele’s
production staff begins the process by optimizing the thermal profile as
a preliminary yet critical step in the assembly process. They analyze
in a detail manner your PCB files, BGA data sheets, BGA size and ball
material composition (leaded or lead-free). For large BGA sizes, the
thermal profile is optimized by localizing internal BGA heating to
prevent a void. Using IPC Class II inspection standards we ensure the
void is below 25 percent of the total solder-ball diameter. Lead-free
BGA applications undergo a specialized lead-free thermal profile to
avoid open ball problems commonly caused by lower temperatures.
Conversely, leaded BGA applications undergo a specialized leaded process
that prevents higher temperatures from causing pin shorts.Upon receipt of your
turnkey PCB assembly order, your PCB design will be reviewed for both
BGA and Design for Manufacturing (DFM) assembly, which includes
examining your requirements for circuit board material, surface finish,
maximum warpage, and solder mask clearance.Evaluations for BGA soldering, BGA Rework and ReballingMOKO offers a BGA soldering service for the testing and
evaluation of BGA rework or reballing tasks. This service is also used
when a client needs a small amount of BGAs or fine pitch parts assembled
on prototype PCBs.To perform BGA rework, we perform the following tasks:Remove componentsPrepare the siteApply solder pasteReplace BGAPerform the reflow processBittele’s BGA rework is guaranteed that no damage will occur on the reworked PCBs.X-Ray InspectionsTo discover soldering defects, such as paste bridging and insufficient
ball melting, as a result of the BGA assembly processes, X-ray
inspection equipment is commonly used to localize the source of the
problem. Bittele’s technicians utilize X-ray analysis software to
calculate the solder ball’s gap size to ensure it is within range of the
IPC Class II standard. They also perform 2-D x-ray tests to obtain 3-D
images to verify problems including, broken vias on the PCB’s inner
layers or cold solder joints of BGA balls.Inquiries and QuotesTo obtain a quote for a future BGA assembly order, including rework, reballing or soldering, please send your request to
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