High thermal conductivity thermal paste for PCB heat dissipation

• 

ROHS Compliant: Yes
UL recognized: Yes

Features and Benefits:
Thermal conductivity: 1~5.5 W/m·K
Excellent thermal performance
Good reliability
Superior ability to flow and conform to interfaces
Non-toxic, non-corrosive

Application: 1. Power supply
2.Between a CPU and a heat spreader
3. Used between a semiconductor and heat sink;
4. Areas where heat needs to be transferred
to the frame or other type of heat spreader
5. Thermoelectric cooling device

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