Automatic bga pick and place machine high precision mounter with optical camera
FP-100 adopts the chromatic optical aligning system with the functions of spectrum, amplification and fine adjustment,equipped with discriminating device for chromatic aberration,Maximum BGA（IC）placement dimensions of 70×70mm,Vacuum nozzle Φ angle of 60°for rotation; accurate fine-adjustment at the directions of X and Y.Mounting head driven by step motor, adopt precise linear guide, can identify mounting height automatically, high placement accuracy
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Pure tin 99.9% lead solder balls for computer chips reballing |
Specical for bga,lead soldering balls 0.25-0.76mm,25W grain one bottle |
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