OV13850CSP-V3.0 BGA test socket test fixture

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ShenzhenYounRongDamicroelectronicstechnologyco.Ltdisaprofessionalsemiconductortestprogramdevelopment,manufacturingandsalesenterprises,withtenyearsofresearchandtestingsocketmakingexperience,.Wemainlyprovidechiptestsocket,burningfixture,programmingdevice,EMMC/TSOPtestsocket,camerachiptestsocket(sensor),automatedtestsocketandconnectortesting.

Contact:Gracexie

Phone:

Mobile:

Otherchip:BGA272,BGA16,HI3512RBC,LC822973,SMS4470,AFE5805,MT9VO11,PLCC40-SNAP,S0101-CSP

OV13850CSP-V3.0BGAtestsocketfeature

Size:8.5*8.5*1.28

Pitch:44

1. Uppercoveradopthandrotatestructure,sensitiveoperation.2.Pressplateofsocketheadadopthumanizationstructure,balancepress,guaranteeICpressequality,andwon’tskewing.3.CrownshapeofPogopinbeabletobreakoxidelayerofsolderball,contactstable,protectsolderballshape.4.Rationalizationlocatingslot,GuideholecanmakesureIClocationright.5SpecialICsupportplatestructure,protectPogopinfreeofoutsideforce.
2. importPogopin,BECUplatedhardgolden,rhodium.Worklifetimeover100000times.
3. Lowcostformaintenance,easytochangepin,costefficiency.
4. Matureworkingaccuracyrange:pitch=0.3mm

10.Deliverytime:inthreedaysearliest.

YuanRongDaserviceprotectionaftersale.

1. Freemaintenancein100days(exceptman-madedamage)
2. Freemaintenanceafterwarranty,onlychargematerialcostiftherehavenecessary.
3. YuanRongDafreeproviderelatedtechnicalsupport.

YuanRongDaservicebeforesale.

1. Provideoperationspecificationandmaintenanceitems..
2. Freetrainhowtousethisproduct.

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