PCT3030 White SMD LED
Advanced centrifugal process packaging technology, uniform light spot, excellent anti-vulcazation performance, comply with the international energy standards of the US Energy Star; material: PCT, gold wire package, the product through high and low temperature thermal shock (-40℃/30min ~~ 125℃/30min) 500 rounds of reliability test, higher than the industry's most stringent reliability test standards, reliable quality.
PCT3030 White SMD LED Description
Safe and reliable, the 3030 LED packagehas obtained test reports and certifications such as LM-80 and EN62471(blue light hazard).
Application:
bulb lamp, downlight, light source module lighting, advertising products
Product Features of PCT3030 White SMD LED
View Anglc: 120°
Package：4000PCS/Packet
Dice:Blue(InGaN）
Operating Temperature:-40～+80℃
Soldering Temperature：260for10sec℃
Super High Power Consumption
Various Colors And Types Available.
Resin(Mold): Silicone
Reverse Voltage:5V
Storage Temperature:-40～+100℃
Pulsed Forward Current 200mA (Duty 1/10, Pulse Width 0.1mS.）
Electrical Parameter(Ta=25℃)
|
PCT3030White SMD LED Product Code |
Common Color Temperature |
SHOUT |
Luminous Flux（lm) |
Forward Voltage |
Current |
Sdcm |
|
S01-P30FXYOA-XXXX-21 |
6250K±250K(062)5000K±250K(A50)3800K±150K(038)3000K±150K(030)1975K±100K(T20) |
70/80 |
110-120 |
150 |
<6 |
|
|
S01-P30FJOA-XXXX-21 |
125-135 |
|||||
|
S01-P30FXYOL-XXXX-22 |
130-140 |
|||||
|
S01-P30FJOS-XXXX-21 |
140-150 |
|||||
|
S01-P30FXYOG-XXXX-21 |
150-160 |
|||||
|
S01-P30FAOG-XXXX-21 |
|
Product Code |
Length Of Grade(nm) |
Luminous Flux（lm) |
Forward Voltage |
Current |
|
S01-P30FXXXX-R620-XX |
620-630 |
50-60 |
350 |
|
|
S01-P30FXXXX-R660-XX |
660-665 |
20-30 |
||
|
S01-P30FXXXX-R730-XX |
730-740 |
250-350 |
||
|
S01-P30FXXXX-G520-XX |
520-530 |
90-100 |
||
|
S01-P30FXXXX-B455-XX |
455-465 |
30-40 |
350 |
COB (Chips on Board), is a new technology of LED packaging for LED light engine. Multi LED chips are packaged together as one lighting module. COB LEDs are basically multiple LED chips (typically nine or more) bonded directly to a substrate by the manufacturer to form a single module. Since the individual LEDs used in a COB are chips and not traditionally packaged, the chips can be mounted such that they take up less space and the highest potential of the LED chips can be obtained. When the COB LED packageis energized, it appears more like a lighting panel than multiple individual lights as would be the case when using several SMD LEDs mounted closely together.
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