Diamond Powder
Industrial diamond powdershas the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powderhas high thermal conductivity and good electrical insulation, can be used as a heat sink for semiconductor devices, has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.
Industrial diamond powderhas the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powderhas high thermal conductivity and good electrical insulation, can be used as a heat sink for semiconductor devices, has excellent light transmission and corrosion resistance, and is widely used inindustrial diamond dust.
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CVD Diamond | CVD (Chemical Vapor Deposition) diamond. The mixture of carbon-containing gas and oxygen is excited and decomposed at a high temperature and a pres... |
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CBN Powder | The cubic boron nitride has a molecular formula of BN. Its atomic structure is similar to the structure of carbon atoms in diamond. Therefore, it h... |
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CBN Mesh Powder | As one of the abrasive powdermanufactures,E-Grind supplies all types of diamond powdersincluding Resin bond diamond, Metal bond diamond, Saw Grit a... |
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Diamond Powder | industrial diamond dusthas the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (hig... |
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Metal Bond Micron Diamond | Our micron diamond powderoffersgood Roughing, Lapping and finishing result. For resin bond, vitrified bond, and electroplated bond. Application: ... |
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