Diamond Powder
Industrial diamond powdershas the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powderhas high thermal conductivity and good electrical insulation, can be used as a heat sink for semiconductor devices, has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.
Industrial diamond powderhas the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powderhas high thermal conductivity and good electrical insulation, can be used as a heat sink for semiconductor devices, has excellent light transmission and corrosion resistance, and is widely used inindustrial diamond dust.
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Metal Bond Micron Diamond | Egrind’s metal bond micron diamond powderoffer good Roughing, Lapping and finishing result. For resin bond, vitrified bond, and electroplated... |
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PDC (Polycrystalline Diamond Compact) Cutter | PDC Cutter(Polycrystalline Diamond CompactCutter) PDC cutter contains polycrystalline diamond layer and tungsten carbide backing. It features both ... |
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Diamond Powder | Diamond is a mineral made of pure carbon and the hardest substance in the natural world. It can not only be processed into valuable jewelry but als... |
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PCD & PCBN | E-Grind supplies the whole range of PCD blanks and PCD PCDNfor cutting tool purpose. The largest Diameter of PCD blanks and PCDN blanks available c... |
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Metal Bond Micron Diamond | E-Grind's metal bond micron products offer good Roughing, Lapping and finishing results. For resin bond, vitrified bond, and electroplated bond.... |
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