Chemical Mechanical Polishing Equipment
Whats/App: +86 156 1874 6768
Web: standard-groups.com
Standards
The system is primarily intended for research and development applications. It supports experimental setups and evaluation methods commonly referenced in:
(1) Semiconductor CMP process research practices
(2) Optical surface finishing and planarization studies
(3) Tribology and wear mechanism investigation methods
Specific test standards depend on user-defined processes and research objectives.
Parameters
| Item | Description |
|---|---|
| Load Control | Closed-loop loading force control with high-precision force sensor |
| Torque Measurement | High-resolution online torque measurement |
| Wafer Holder | Self-leveling fixture with active rotation and horizontal oscillation |
| Sample Size Range | 0.5 inch to 4.25 inches |
| Platform | Fully automated XY platform with quick-change capability |
| Speed Control | Wide adjustable speed range via programmable control |
| Slurry Delivery | Automatic slurry delivery system |
| Inline Sensors | Torque, temperature, and acoustic emission |
| Surface Measurement | Integrated inline three-dimensional optical profiler |
Features
Real-time measurement of friction coefficient during polishing
Precise control of loading force and rotational speed through closed-loop feedback
Integrated three-dimensional optical surface profiler for inline morphology analysis
Compatibility with multiple wafer and sample sizes
Online monitoring of torque, temperature, and acoustic emission signals for accurate endpoint detection
Accessories
(1) Self-leveling wafer fixture
(2) Quick-change wafer and pad holders
(3) Automatic slurry delivery system
(4) Inline torque sensor
(5) Acoustic emission sensor
(6) Online temperature monitoring module
(7) Integrated 3D optical profiler
Test Procedures
Mount the wafer or substrate using the appropriate quick-change fixture and ensure proper self-leveling.
Select a predefined test program or create a custom polishing program, setting load force, speed, and slurry flow.
Start the polishing process; the system automatically controls force and motion while delivering slurry.
Monitor real-time signals such as torque, temperature, and acoustic emission during polishing.
Use inline three-dimensional surface measurement to evaluate surface morphology and polishing progress.
Stop the test automatically or manually based on endpoint criteria or signal thresholds.
Maintenance Information
Clean wafer holders, polishing pads, and slurry delivery components after each test to prevent residue buildup.
Periodically verify calibration of force, torque, temperature, and acoustic emission sensors.
Inspect mechanical motion components and the XY platform to ensure smooth and accurate operation.
Keep optical components of the inline profiler clean to maintain measurement accuracy.
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