Thermal Conductivity Tester (Heat Flow Method)
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Thermal Conductivity Tester (Heat Flow Method) is a precision instrument designed for measuring thermal conductivity, thermal resistance, and interfacial contact thermal resistance of thin thermally conductive and electrically insulating solid materials. The system is fully designed and manufactured in accordance with ASTM D5470-2017. adopting the steady heat flow method with optimized temperature gradient measurement. With automated pressure loading, automatic thickness measurement, multi-point temperature detection, and computer-controlled operation, the instrument enables accurate evaluation of thermal resistance curves under different pressures and temperatures. It is widely used for thermal performance analysis of solid sheet materials, interface materials, and high-conductivity components in laboratory and industrial environments.
Application
The Thermal Conductivity Tester is mainly used for thermal performance evaluation of thin solid materials and interface materials, including:
Thin thermally conductive solids and electrically insulating materials
Thermal interface materials such as thermal grease, thermal silicone, resins, and rubber
Ceramic materials including beryllium oxide ceramics and alumina ceramics
Metal substrates and composite boards such as aluminum substrates and copper-clad laminates
Engineering plastics and polymer-based materials
Graphite materials including graphite paper, graphite sheets, carbon felt, and foam copper
Solid sheet samples, with optional frames for testing powder and paste materials
The instrument measures thermal conductivity, thermal resistance, and interfacial contact thermal resistance, supporting testing under different pressures and temperatures.
Standards
The instrument complies with and references the following international and national standards:
ASTM D5470-2017
Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials
MIL-I-49456A
Insulation Sheet Materials, Thermally Conductive, Resin-Based and Glass Fiber Reinforced
GB/T 5598-2015
Method for Determination of Thermal Conductivity of Beryllium Oxide Ceramics
GB/T 29313-2017
Test Method for Thermal Conductive Properties of Electrical Insulating Materials
Parameters
| Item | Specification |
|---|---|
| Thermal conductivity range | 0.01–50 W/m·K; 5–500 W/m·K (high-conductivity mode, automatic software switching) |
| Thermal resistance range | 0.05–500 cm²·K/W |
| Sample size (standard) | Φ30 mm or 20 × 20 mm |
| Optional sample sizes | Φ15 mm, Φ50 mm, 25.4 × 25.4 mm (customized by contract) |
| Sample thickness range | 0.001–50 mm (typical: 0.02–20 mm) |
| Hot plate temperature range | Room temperature to 99.99 °C (standard) |
| Optional hot plate range | Room temperature to 299.9 °C / 500 °C |
| Cold plate temperature range | 0–99.99 °C |
| Cold plate control accuracy | 0.01 °C |
| Pressure range | 0–1000 N |
| Pressure control | Servo motor control, accuracy 0.1 N |
| Thickness measurement range | 0–50.00 mm |
| Thickness resolution | 0.001 mm, automatic measurement |
| Number of samples | 1 piece (thin films or stacked layers supported) |
| Measurement error | ≤3% (thermal conductivity & resistance) |
| Contact thermal resistance error | ≤5% |
| Power supply | AC 220 V / 50 Hz |
| Power consumption | 1000 W |
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