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UV Laser Cutting Machine JG16

Laser Cutting Machine

Usage

The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.

Feature

(1)Precision:

Adopting high-precision linear motor modules, servo control, Sizing Compensate, optical positioning and secondary positioning technologies.

(2)High quality

(a)little carbonization;

(b)high density graphics cutting.

(3)Highly intelligent, efficient

(a)With multi-panels cutting, auto-positioning, auto-correcting, automatically focus, automatic sizing compensation and exclusive cutting previews functions;

(b)JG16 use double working table to save time of feeding and blanking materials.

Parametres

Specification of href="" UV Laser Cutting Machine

Model

JG16

Wavelength

355nm

Laser Power

Option (Standard10W)

Laser Frequency

30-120kHz

Maximum Processing Size

500mm x 400mm

(Double platform)

Maximum Operating Speed

800mm/s

Positioning Accuracy of Table

±3μm

Repetitive Positioning Accuracy of Table

±1μm

Total Accuracy

±20um

light spots

20±5μm

Scanning range

45mmx45mm

File Format

*.gbr & *.dxf & *.lay

Electric Power Supply

AC220V/2kW;AC380V/5.5kW

Dimensions(L x W x H)

1850mmx1640mmx1650mm

Weight

2400kg

Environmental Temperature

20±2℃

Environmental Humidity

≤60%RH,Non-condensing

Ground Amplitude

≤5μm

Ground Pressure

≥1000Kgf/m2



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