Electroformed Hub Dicing Blade
Electroformed Hub Dicing Blade
Electroformed Hub Dicing Blade Is Used For Cutting Silicon Wafers, Copper Wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass
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Details
Electroformed Hub Dicing Blade Is Made By Using An Ultra-ThinDiamondWheel And A High Precision Aluminum Alloy Hub.
Applications Of Hub Dicing Blade:
Cutting Silicon Wafers, Copper Wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass
The Features Of Hub Type Dicing Blade:
* Improving Balance Between Blade Life And Processing Quality (In Particular Backside Chipping)
* Strengthens Rigidity, Reduction In Wavy Cutting And Blade Wear Under High Load Conditions
* Precise Control OfDiamondGrit Size, Diamond Concentration, And Nickel Bond Hardness To Reduce Splitting On The Edges
* Realizes High Speed Wafer Cutting After Laser Grooving.
The Specification Of Hub Type Dicing Blade:
| Exposure(Μm) | 380 | 510 | 640 | 760 | 890 | 1020 | 1150 | 1270 | Grit Size |
| Kerf Width(Μm) | 380 - 510 | 510 - 640 | 640 - 760 | 760 - 890 | 890 - 1020 | 1020 - 1150 | 1150 - 1270 | 1270 - 1400 |
#5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500 |
| 16 - 20 | 20 * 380 | 20 * 510 | |||||||
| 21 - 25 | 25 * 380 | 25 * 510 | 25 * 640 | ||||||
| 26 - 30 | 30 * 380 | 30 * 510 | 30 * 640 | 30 * 760 | 30 * 890 | 20 * 1020 | |||
| 31 - 35 | 35 * 380 | 35 * 510 | 35 * 640 | 35 * 760 | 35 * 890 | 35 * 1020 | |||
| 36 - 40 | 40 * 380 | 40 * 510 | 40 * 640 | 40 * 760 | 40 * 890 | 40 * 1020 | 40 * 1150 | ||
| 41 - 50 | 50 * 380 | 50 * 510 | 50 * 640 | 50 * 760 | 50 * 890 | 50 * 1020 | 50 * 1150 | 50 * 1270 | |
| 51 - 60 | 60 * 510 | 60 * 640 | 60 * 760 | 60 * 890 | 60 * 1020 | 60 * 1150 | 60 * 1270 | ||
| 61 - 70 | 70 * 640 | 70 * 760 | 70 * 890 | 70 * 1020 | 70 * 1150 | 70 * 1270 | |||
| 71 - 80 | 80 * 890 | 80 * 1020 | 80 * 1150 | 80 * 1270 | |||||
| 81 - 90 | 90 * 1020 | 90 * 1150 | 90 * 1270 |
| 90 * 1270 |
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