15A2 Resin Bond Diamond Grinding Wheel for Carbide
Workpiece Materials: grinding tungsten carbide cutting tools, ceramic, magnetic materials, silicon, glass, quartz and thermal spraying alloy, etc.
Applicable Industry:CNC Tool Grinding, Woodworking Tool Grinding, Thermal Spraying Coated, Silicon Wafer Grinding, etc.
Type: 1A1R, 1A1, 3A1, 1V1, 4A2, 4BT9, 6A2, 11V9, 12A2, 14F1, etc.
Details
Resin bond grinding wheels are the most commonly used super abrasive product currently. our resin diamond wheel is suitable for surface grinding, OD grinding, centerless grinding, tool grinding, fine grinding, double disc grinding and slot grinding of most precision workpieces.
Applications of resin diamond grinding wheel
Resin bond diamond grinding wheel is mainly used for machining tungsten carbide cutting tools, ceramic, magnetic materials, silicon, glass, quartz and thermal spraying alloy, etc.
Advantages of resin diamond grinding wheel
* High cutting efficiency, good self-sharpening, less blocking, reducing the grinding burn occurs when the phenomenon of work
* Good flexibility will help to improve the surface roughness, mainly used for rough grinding, semi-fine grinding, polishing and other processes
* Compared to conventional silicon carbide, resin diamond wheel has good material removal rates, longer wheel life and lower grinding costs
* Resin bond diamond wheels generally remove material up to 10 times faster than metal bond wheels
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