.

Electroformed hub dicing blade

Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass.

Details

Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub.

Applications Of Hub Dicing Blade

Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass

The Features Of Hub Type Dicing Blade

* Improving balance between blade life and processing quality (in particular backside chipping)

* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions

* Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges

* Realizes high speed wafer cutting after laser grooving



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