Flip Chip Technologies
Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different forms, including:Solder Bumped Flip Chip TechnologyAnisotropic Conductive Adhesive Flip Chip TechnologyUltrasonic Bonding Flip Chip TechnologyIn addition, Topscom performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.
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Topscom Electronics has a focused staff of Test Development engineers dedicated to Functional Test development. With the ownership of Functional Te... |
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Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different forms, inc... |
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Topscom offers complete prototyping and product introduction services for process verification, initial product introduction ramp and transfer to v... |
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Tooling design and manufacturing is one of Topscom’s key strengths. By staffing expert tooling designers, skilled tool and die makers, and precisio... |
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Topscom specializes in developing software for the networking and telecommunications industries and has successfully delivered a number of carrier-... |
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