Epoxy potting sealants WOC-87-II-D(A)/(B)
■ Description
The product is heat conduction type epoxy adhesive, it is two-component epoxy adhesive.
Curing under room termperature, low of shrinkage rate. The heat conduction is good after curing, resistance to water is good,excellentelectrical properties and have flame retardant property.
■ Applications
The product is used as sealant in high of heat conduction modules and PCB
■ General properties
|
Test Item |
Test Mothed/Conditions |
WOC-87-II –D A |
WOC-87-II –D B |
|
Appearance |
Visualization |
Black viscous liquid |
Slight yellow transparent liquid |
|
Density |
25º C g/m³ |
||
|
Viscosity |
40º C mpa.s |
1000 - 5000 |
25 - 60 |
|
Viscosity(blended) |
40º C mpa.s |
600 |
|
|
Storage validity |
Sealed and storage Temp.below 25º C |
6 months |
6 months |
|
Ratio of blend |
Weight/Weight |
100 |
20-25 |
|
Curing condition |
º C/hrs |
25 º C/24h |
|
■ Characteristics after curing
|
Item |
Unit/Conditions |
WOC-87-II-D A/B |
|
Hardness |
Shore-D |
＞78 |
|
Insulation Strength |
25º C kv/mm |
≥18 |
|
Shear Strength |
Mpa, Steel/Steel |
≥6 |
|
Permittivity |
25º C,1.2MHZ |
|
|
Surface Resistance |
25º C Ω.cm |
＞1013 |
|
Volume Resistance |
25º C Ω.cm |
＞1.5 x 1014 |
|
Curing Shrinkage Rate |
% |
＜0.6 |
|
Thermal Conductivity |
w/m.k, 25º C |
＜0.8 |
■ Storage, Packaging
- Sealed and storage Temperature below 25º C after each operation
- Please see the term of validity in each packages
- Packages: A component is 25kg, B component is 10kg or 25kg
- The storage validity is 6 months, a little precipitate shall be occurred provided high temperature. Please stir the material before using.
Note: The above data was tested under the conditions of 70% humidity and 25º C Temperature, This is for your reference only.
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