Epoxy potting adhesives WOCC-87-II(A)/G-23(B)
■ Description
Two-component encapsulating system based on epoxy resin, is room temperature curing as well as middle temperature curing epoxy resin.
Excellent of the surface gloss of the cured epoxy resin, excellent insulation andelectrical properties,good of heat/cold shock resistance and have good tenacity property.
■ Applications
Encapsulation of electrical components of Capacitor, Inductor, Igniter, Transformer, trigger and Filter.
■ General properties
|
Test Item |
Test Mothed/Conditions |
WOCC-87-II A |
G-23 B |
|
Appearance |
Visualization |
All color viscous liquid |
Slight yellow transparent liquid |
|
Density |
25º C g/m³ |
||
|
Viscosity |
40º C mpa.s |
1000 - 5000 |
5 - 15 |
|
Viscosity (A+B blended) |
40º C mpa.s |
600 - 1000 |
|
■ Using process
|
Item |
Unit/Conditions |
WOCC-87-II A |
G-23 B |
|
Ratio of blend |
Weight/Weight |
100 |
15 |
|
Using time available |
25º C hrs |
60-90 min, the user can lengthen or shorten according to the demands |
|
|
Curing condition |
º C/hrs |
25/36 or 60/3h |
|
■ Characteristics after curing
|
Item |
Unit/Conditions |
WOCC-87-II A/G-23 B |
|
Hardness |
20º C Shore-D |
＞68 |
|
Volume Resistance |
25º C Ω.cm |
＞1014 |
|
Surface Resistance |
25º C Ω.cm |
＞1013 |
|
Insulation Strength |
25º C kv/mm |
≥20 |
|
Bending Strength |
Kg/cm2 |
≥82 |
|
Volume Shrinkage |
% |
≤0.5 |
|
Glass transition temperature |
Tgº C |
≥60 |
|
Flame Retardancy |
UL 94 |
V0 or V1 |
|
Heat/cold Shock Resistance |
-20 to 120º C |
Cycle times: more than 6 |
■ Storage, Packaging
The storage validity is 6 months, a little precipitate shall be occurred provided high temperature. Please stir the material before using.
Note: The above data was tested under the conditions of 70% humidity and 25º C Temperature, This is for your reference only.
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