Cycloaliphatic Epoxy Resin
Cycloaliphatic epoxy resinrefer to a series of products obtained by oxidation with butadiene and acrolein as base materials and the mixture of hydrogen peroxide and peracetic acid as oxidant. They have a variety of applications, including 3D printing, coating, ink, adhesives, composites, and electronics, among others.
Cycloaliphatic epoxideresins may be cured by anhydride-based methods as well as UV/EB- and thermally-curable methods.
Types of Cycloaliphatic Epoxy Resins
TTA21: 3,4-Epoxycyclohexylmethyl- 3',4'-Epoxycyclohexane Carboxylate
As the typical cycloaliphatic epoxy resin, TTA21 is most widely used in coatings, inks, adhesives, 3D printing and other fields.
TTA26: Bis (3,4-Epoxycyclohexylmethyl) Adipate
TTA26 has excellent weather resistance and electrical insulation, low curing shrinkage, good heat resistance, low viscosity and good toughness.
TTA3150: Poly[(2-oxiranyl)-1,2-cyclohexanediol] -2-ethyl-2-(hydroxymethyl)-1,3-propanediol Ether
TTA3150 contains very few chloride ions and chloride salts, and has the characteristics of high transparency, high heat resistance, high Tg, excellent weather resistance, and excellent electrical properties.
TTA3150 CE: Mixture of TTA3150 & TTA21 (TTA3150CE)
Mixture of TTA3150 & TTA21.
TTA27: 1,2:5,6-Diepoxyhexahydro-4,7-methanoindan
TTA27 is characterized by a close bicyclic structure between two epoxy groups and a stable methylene bridge across the six membered ring.
TTA28: Tetrahydroindene Diepoxide
TTA28 is characterized by the saturated double cycloaliphatic epoxy structure without ester bond, small molecular weight and extremely low halogen content.
TTA11: 4-Vinyl-1-Cyclohexene 1,2-Epoxide
TTA11 contains a double bond structure which can be used for hydrosilation in the synthesis of cycloaliphatic epoxy resins containing siloxane segments.
TTA15: 3,4-Epoxycyclohexylmethyl methacrylate
This product is an epoxy acrylate resin with a saturated alicyclic structure.
TTA16: 3,4-Epoxycyclohexylmethyl Acrylate
TTA16 does not contain methyl group, and the acrylate resin generated after participating in the synthesis reaction has better reactivity performance than TTA15.
TTA22: 1,2-Epoxy-4-epoxyethylcyclohexane
TTA22 is a kind of cycloaliphatic bisepoxide, which can react with anhydride, amine, and other curing agents.
TTA800: (3,4,3',4'-dicycloxyl) Bicyclohexane
TTA800 has excellent heat resistance, high electrical insulation property, high cation reaction activity, low viscosity, and high transparency.
Advantages of Cycloaliphatic Epoxy Resin
The cycloaliphatic epoxy speciality resinhas strong dilution ability. There will be an obvious dilution effect when the addition amount in the formula exceeds 20%.
The glass transition temperature (Tg) of cycloaliphatic epoxy resin TTA21P is 204 ℃, much high than the other common epoxy resin.
The cycloaliphatic epoxy resin TTA21 has excellent adhesion on a variety of substrate surfaces.
The figure shows that the volume shrinkage of cycloaliphatic epoxy resin after UV curing is significantly lower than that of acrylate.
When 20% of the cycloaliphatic epoxy resin is added to the formula, the product has played a very positive role in overcoming oxygen polymerization inhibition.
Compared with bisphenol A epoxy, cycloaliphatic epoxy has little difference between the dielectric constant and dielectric loss at room temperature but the difference is obvious at high temperature. It has obvious advantages in the application field of insulating castable.
What Is Cycloaliphatic Epoxy Resin?
Cycloaliphatic epoxy resin refers to a series of products obtained by oxidation with butadiene and acrolein as base materials and the mixture of hydrogen peroxide and peracetic acid as oxidant. Epichlorohydrin is not selected as the synthetic base material, thus, the molecular structure does not contain any benzene ring and hydroxyl group, and the epoxy group is directly connected to the cycloaliphatic ring through oxidation reduction.
As one of cycloaliphatic epoxy resin manufacturers, we will do our best to meet all the needs of customers.
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