.

pcb

  • DataInputs-Protel,DXP,Gerber,DXF,DWG,CAM
  • MajorLaminate-Kingboard,ShengYiandothersproducebycustomerspecialrequest
  • BaseMaterials-FR4,othermaterialsincludingHighTg,HighCTI,HalogenFreebyspecialrequested
  • PCBMaximumboardsizeHASL:546mmx320mm,OSP:630mmx470mm,Ni/Au:570mmx470mm
  • RigidPCBthicknessSingle-sidetoDoublesidefrom0.2mm-3.0mm4layers-0.4mm-3.0mm/6layers-0.6mm-3.0mm/8layers-1.0mm-3.0mm10layers-1.20mm-3.0mm/12layers-1.40mm-3.0mm(SmallrunandPrototypeonly)
  • SurfaceFinishing-HAL/HASL,OSP,ImmersionGold,ImmersionTin
  • CopperFoil-from0.5ozto6oz,innerlayerupto3oz
  • Min.Holesize-0.20mm,Aspectratio=8
  • Viaholes-CopperPTH,Blindvia
  • HDI-Class1forsingleBlindvia
  • Impedancecontroltolerance-+/-10%
  • Min.LineWidthandSpacing-Max.0.10mm/0.10mm(4mil/4mil)
  • Solderresistmask-LiquidPhoto-Image(LPI)
  • SilkscreenINK-Thermal
  • Profiling-Routing,V-cut,Punching,CNCV-cut,Pushback

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