Layer Count/Technology

4-20 layers

4-20layers

PCB Thickness Range

Build Up Technology

1-N-1 / 2-N-2 / 3-N-3 / 4-N-4

1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / 5-N-5 / 6-N-6 / 7-N-7

110μm

75μm

Laser Techlology

CO2 Direct Drilling（UV/CO2)

CO2 Direct Drilling（UV/CO2)

Materials

FR4/FR4 Halogen Reduced

FR4 / Taconic / Rogers / Others on request

Class Transition Temperature

140℃/ 150℃/ 170℃

140℃/ 150℃/ 170℃/ 200℃

Standard Glass Cloth

1027/106 / 1080/2116 / 1501/7628

1037/106 / 1080/2116 / 1501/7628 / 1027/

Copper Thickness

12μm/18μm/35μm/70μm

9μm/12μm/18μm/35μm/70μm/105μm

Copper Plating Holes

20μm（25μm）

13μm / 20μm / 25μm

60μm / 60μm

40μm / 40μm

Soldermask Registration

70μm

60μm

+/-38μmPhoto-imageable）

+/- 25μm（Photo-imageable）

Soldermask Color

Green / White / Black / Red / Blue

Green /White / Black / Red / Blue

575mm × 500mm

575mm × 500mm

Production Panel

125μm

100μm

Smallest Drill

Smallest Routing Bit

Surfaces

OSP/Immersion Tin

OSP/Immersion Tin

Immersion NI/AU

Immersion NI/AU

Plated Ni/AU

Plated Ni/AU

immersion AG

immersion AG

Scoring

Yes

Yes

ID Print

White

White