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Professional printed circuit board assembly process factory

Professional printed circuit boardassembly process factory

printed circuit board assembly process factory

● 4 YAMAHA High-speed SMT Lines

● 6 million daily SMT placements capability

● 400,000 daily DIP placements capability

● 500×600 mm Maximum Board Size

● 0.25"x 0.25" Minimum Board Size

● 450 mm Max. Width for Wave-Solder

● Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement

SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly

Professional printed circuit board



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