Thermal Conductivity Tester (Heat Flow Method)

Whats/App: +86 156 1874 6768

Web: standard-groups.com

Thermal Conductivity Tester (Heat Flow Method) is a precision instrument designed for measuring thermal conductivity, thermal resistance, and interfacial contact thermal resistance of thin thermally conductive and electrically insulating solid materials. The system is fully designed and manufactured in accordance with ASTM D5470-2017. adopting the steady heat flow method with optimized temperature gradient measurement. With automated pressure loading, automatic thickness measurement, multi-point temperature detection, and computer-controlled operation, the instrument enables accurate evaluation of thermal resistance curves under different pressures and temperatures. It is widely used for thermal performance analysis of solid sheet materials, interface materials, and high-conductivity components in laboratory and industrial environments.

Application

The Thermal Conductivity Tester is mainly used for thermal performance evaluation of thin solid materials and interface materials, including:

Thin thermally conductive solids and electrically insulating materials

Thermal interface materials such as thermal grease, thermal silicone, resins, and rubber

Ceramic materials including beryllium oxide ceramics and alumina ceramics

Metal substrates and composite boards such as aluminum substrates and copper-clad laminates

Engineering plastics and polymer-based materials

Graphite materials including graphite paper, graphite sheets, carbon felt, and foam copper

Solid sheet samples, with optional frames for testing powder and paste materials

The instrument measures thermal conductivity, thermal resistance, and interfacial contact thermal resistance, supporting testing under different pressures and temperatures.

Standards

The instrument complies with and references the following international and national standards:

ASTM D5470-2017

Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials

MIL-I-49456A

Insulation Sheet Materials, Thermally Conductive, Resin-Based and Glass Fiber Reinforced

GB/T 5598-2015

Method for Determination of Thermal Conductivity of Beryllium Oxide Ceramics

GB/T 29313-2017

Test Method for Thermal Conductive Properties of Electrical Insulating Materials

Parameters

Item	Specification
Thermal conductivity range	0.01–50 W/m·K; 5–500 W/m·K (high-conductivity mode, automatic software switching)
Thermal resistance range	0.05–500 cm²·K/W
Sample size (standard)	Φ30 mm or 20 × 20 mm
Optional sample sizes	Φ15 mm, Φ50 mm, 25.4 × 25.4 mm (customized by contract)
Sample thickness range	0.001–50 mm (typical: 0.02–20 mm)
Hot plate temperature range	Room temperature to 99.99 °C (standard)
Optional hot plate range	Room temperature to 299.9 °C / 500 °C
Cold plate temperature range	0–99.99 °C
Cold plate control accuracy	0.01 °C
Pressure range	0–1000 N
Pressure control	Servo motor control, accuracy 0.1 N
Thickness measurement range	0–50.00 mm
Thickness resolution	0.001 mm, automatic measurement
Number of samples	1 piece (thin films or stacked layers supported)
Measurement error	≤3% (thermal conductivity & resistance)
Contact thermal resistance error	≤5%
Power supply	AC 220 V / 50 Hz
Power consumption	1000 W

Features

Designed and manufactured fully in accordance with ASTM D5470-2017

Automated servo motor pressure control with precise force setting and holding

Automatic thickness measurement with high resolution

Six-point temperature gradient detection for improved measurement accuracy

Thermal protection structure around the test rod to reduce environmental influence

Capable of measuring thermal resistance curves under different pressures and temperatures

Optimized mathematical models for thermal conductivity and contact thermal resistance

Automatic cold-end temperature compensation without ice-water compensation

Fully computer-controlled operation with data acquisition, analysis, and reporting

Available in standard floor-standing and compact benchtop configurations

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