Precision Laser Micromachining Machine

Precision Laser Micromachining Machine| Ultrafast Laser Micromachining Systems

Chanxan provides advanced laser micro processing machinesfor high-precision cutting, drilling, dicing, grooving, etching and surface structuring of difficult-to-process materials. Our laser micromachining systems are designed for manufacturers that require micron-level accuracy, clean edges, low heat affected zones and stable production performance.

From FPC, PCB, PI film and PET film processing to wafer dicing, glass cutting, ceramic drilling and semiconductor material micromachining, Chanxan offers nanosecond, picosecond and femtosecond laser systems to match different material properties, production speeds and accuracy requirements.

As an experiencedindustrial laser equipmentmanufacturer, we support customers with process testing, machine configuration, automation integration and long-term technical service.

Our Laser Micro Processing Machine Series

Nanosecond Laser System for High-Speed Industrial Micromachining

The nanosecond laser system is suitable for high-speed, high-precision processing of PCB, FPC, PI, ceramics, camera modules, metals, polymers and other industrial materials. It offers stable cutting, drilling and etching performance for manufacturers that need efficient micro processing with reliable dimensional consistency.

With micron-level motion control, optimized thermal management and automated system integration, theNanosecond Laser Systemis a practical choice for high-volume electronics and precision component production.

Recommended applications:

· PCB and FPC cutting

· Camera module processing

· Ceramic substrate cutting

· PI and polymer material processing

· Thin metal and alloy micromachining

Picosecond Laser System for Clean Cold Processing

The picosecond laser processing machine is designed for materials that are sensitive to heat, carbonization or edge deformation. With ultrashort pulse technology, the system reduces thermal diffusion and helps achieve cleaner edges, smaller heat affected zones and better processing quality.

Chanxan’sPicosecond Laser Systemis widely used for FPC, PI films, LCP materials, foils, polarizers, flexible OLED materials and precision electronic components.

Recommended applications:

· FPC cover film cutting

· PI film window opening

· LCP material processing

· Thin foil cutting and drilling

· Flexible electronics micromachining

· Semiconductor packaging material processing

Femtosecond Laser System for Ultra-Precision Micro Processing

For high-value materials and extremely strict accuracy requirements, the femtosecond laser micromachining system provides near-zero thermal impact and excellent edge quality. It is suitable for advanced ceramics, sapphire, glass, silicon wafers, medical polymers, high-performance alloys and other difficult materials.

TheFemtosecond Laser Systemis recommended for customers that require ultra-precision laser micro processing with minimal heat conduction, reduced micro-cracking and stable repeatability.

Recommended applications:

· Sapphire and UTG processing

· Silicon wafer micromachining

· Advanced ceramic cutting

· Medical device component processing

· Micro drilling and fine structuring

· High-precision research and production applications

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