iFixes Solder PasteiFixes Solder Paste 138℃ 158℃ 183℃ 217℃ PCB BGA Chip Flux 138℃ 158℃ 183℃ 217℃ PCB BGA Chip Flux

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iFixes solder paste is138 is158 is183 is217 conductive silver paste for mobile chip repair. iFixes high-density flux for iPhone iPad Phone PCB BGA soldering, desoldering and repair. iFixes 50g 138℃ 158℃ 183℃ 217℃ low/medium/high temperature silver-containing anti-resistance tin paste flux is specially used for mobile chip repair.

Features:
1. New silver formula, higher specifications, to solve the pain points of mobile maintenance.
2. iFixes contains silver anti-resistance tin paste, professional for mobile chip tinning, four temperatures optional.
3. High resistance, high density, strong soldering ability.
4. Bright solder joints, strong soldering force.
5. Not easy to dry, less tinning, high yield rate.

iFixes 138/158/217℃ Solder Paste Parameter:
Brand: iFixes is138 is158 is217.
Melting Point: 138℃/158℃/217℃.
Storage: 0-10°C.
Weight: 50g.
Microns: 25-45um (Sn42 Bi58).

iFixes 183℃ Solder Paste Parameter:
Brand: iFixesis183.
Melting Point: 183°C.
Storage: 0-10°C.
Weight: 50g.
Microns: 20-38um (Sn63 Pb377).

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