High Baud Rate Ceramic Packages for Integrated Coherent Receiver (ICR)
Sinopack manufactures 100Gbps (4x25Gbps) packages, RF Layout: GSSG x 4ch
Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module package, power laser package, microwave device package, high- density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products
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100Gbps TOSA / ROSA Packages for CFP4 / QSFP28 Transceivers | These packages feature Ceramic-to-metal feed-thru leads for optimal function and reliability. Metal body with standard or custom heat sink material... |
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25Gbps Ceramic Leadless Chip Carriers (CLCC) for Modulator Drivers | Surface Mount Packages Low Insertion Loss: -1dB min. (DC~32GHz) Low Return Loss: -15dB max. (DC~32GHz) Cu-Mo Heat Sink Sinopack devotes to the R&am... |
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TO-254 and TO-257 Ceramic Packages for Power Electronics | Sinopack provides power electronics packages by using ceramic-to-metal bonding technologies Sinopack devotes to the R&D and manufacturing of mu... |
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TOSA Ceramic Packages for Micro Integrable Tunable Laser Assembly (µ-ITLA) | Low Return Loss: -15dB max. (DC~15GHz) Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages.The main products are HTCC,... |
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Sinopack Ceramic Packages for High Power Laser Devices | Using for metal wall - ceramic feedthrough structure, high electrical conductivity, lead can withstand high current. Heat sink for the heat conduct... |
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